Methods and apparatuses for compensating for source voltage

ABSTRACT

Apparatuses and methods for compensating for source voltage are described. An example apparatus includes a source cooled to a memory cell and a read-write circuit coupled to the memory cell. The apparatus further includes a sense current generator coupled to a node or the source and to the read-write circuit, the sense current generator configured to control provision of a sense current by the read-write circuit responsive to a voltage of the node of the source.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/019,687, filed Feb. 9, 2016, issued as U.S. Pat. No. 9,595,303 onMar. 14, 2017, which is a continuation of U.S. application Ser. No.13/689,386 filed Nov. 29, 2012, and issued as U.S. Pat. No. 9,257,154 onFeb. 9, 2016. The aforementioned applications and patents areincorporated herein by reference in entirety and for any/all purpose.

TECHNICAL FIELD

Embodiments of the invention relate generally to electronic memories,and more particularly, in one or more of the illustrated embodiments, toreading of electronic memories.

DESCRIPTION OF RELATED ART

Advances in technology have resulted in high density memoryarchitecture. Increased density of memory may lead to signal lineshaving smaller feature sizes, for example, thinner signal lines, whichresults in increased inherent parasitic resistance along the signallines. Further, high density architecture fabrication can lead tofluctuation in memory device components. For example, similar componentscan exhibit slightly different electrical response characteristics undersimilar conditions. The increased resistance of signal lines and thefluctuation in memory device components can lead to decreasedreliability during memory access operations. In some memories, a sourceline is coupled to memory cells of a memory array, and may be used foraccessing the memory cells, for example, reading data from the memorycells. For memories having high capacity and a large page size, thesource line may be physically long and have inherent parasiticresistance along its length. As dimensions of the source line arereduced, for example, the source line is thinner as a result ofincreased density of memory, the inherent parasitic resistance of thesource line may increase. Increased resistance along the source line andvariation in electrical response characteristics can lead to variancesin sense current and voltage levels used to detect data along a senseline during a memory read operation. Variances in the sense current andvoltage levels along a sense line can cause a detection circuit todetect an incorrect value stored in a memory cell.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram of a particular illustrative embodiment of anapparatus including a memory access circuit;

FIG. 2 is a diagram of a particular illustrative embodiment of anapparatus including a sense current generator;

FIG. 3 is a diagram of a particular illustrative embodiment of anapparatus including a flag signal generator.

FIG. 4 is a diagram of a particular illustrative embodiment of anapparatus including a currently subtract circuit;

FIG. 5 is a diagram of a particular illustrative embodiment of a flagsignal generator; and

FIG. 6 is a diagram of a memory according to an embodiment of theinvention.

DETAILED DESCRIPTION

Certain details are set forth below to provide a sufficientunderstanding of embodiments of the invention. However, it will be clearto one having skill in the art that embodiments of the invention may bepracticed without these particular details. Moreover, the particularembodiments of the present invention described herein are provided byway of example and should not be used to limit the scope of theinvention to these particular embodiments.

Referring to FIG. 1, a particular illustrative embodiment of anapparatus (e.g., an integrated circuit, a memory device, a memorysystem, an electronic device or system, a smart phone, a tablet, acomputer, a server, etc.) including a memory access circuit is disclosedand generally designated 100. The apparatus 100 may include read-writecircuits 150(1-N) each coupled to a memory cell array 160 having aplurality of memory cells 162(1-N). A sense current generator 110 and abitline voltage generator 120 may be coupled to each of the read-writecircuits 150(1-N) to provide a bias voltage signal VBIASPSRC and abitline voltage signal VBLC, respectively, to each of the read-writecircuits 150(1-N). The VBIASPSRC signal has a voltage that is based onthe source voltage. A word line voltage generator 130 may be coupled tothe memory cell array 160 to provide a word line voltage signal VWL toeach of the memory cells 162(1-N) of the memory cell array 160. A sourcevoltage generator 140 may be coupled to the source and configured tocouple the source to a reference node. The reference node may be coupledto a voltage reference, for example, ground.

Each of the read-write circuits 150(1-N) may include a sense currenttransistor 152(1-N) coupled to a respective bitline voltage transistor154(1-N) along a sense line. Each of the sense current transistors152(1-N) may be coupled to a voltage supply note, such as a nodesupplying VCC. A gate of each, of the sense current transistors 152(1-N)may be coupled to the sense current generator 110. Each of the bitlinevoltage transistor 154(1-N) may be coupled to a respective bitline ofthe memory cell array 160. A gate of each of the bitline voltagetransistors 154(1-N) may be coupled to the bitline voltage generator 120to receive the VBLC signal. Each of the read-write circuits 150(1-N) mayprovide a sense signal VSEN1-N to a respective detection circuit (notshown). The detection circuits may determine a data state of the memorycells based on the respective VSEN1-N signals.

Each bitline of the memory cell array 160 may be coupled to a respectivestring of memory cells, each of which being represented in FIG. 1 as arespective memory cell 162(1-N). In an embodiment, each of the memorycells 162(1-N) may be a non-volatile memory cell. Each of the memorycells 162(1-N) may be coupled (e.g. either directly, as in the case of aNOR architecture, or indirectly, as in the case of a NAND architecture)to a source. The source may have an inherent parasitic resistance Rs andeach, bitline may have an inherent capacitance Cbl. In an embodiment,the source may include a source line, a source slot, and/or a sourceregion.

During a read operation, the sense current generator 110 provides theVBIASPSRC signal to a gate of each of the sense current transistors152(1-N) to control the provision of a sense current during a memorycell bitline development delay time. The bit line development delay timeis a period of time to allow a voltage to develop on the bit line inpreparation to read a respective memory cell 162(1-N). Further, thebitline voltage generator 120 provides the VBLC signal to a gate of eachof the bitline voltage transistors 154(1-N) to clamp each cell bitlineat a baseline voltage for the read operation. The source voltagegenerator 140 couples the source to the reference node to provide aconduction path via the source voltage transistor 142. The wordlinevoltage generator 130 provides the VWL signal to a gate of each of thememory cells 162(1-N) of a plurality of the memory cell array 160. Insome embodiments, the plurality of memory cells represent a page ofmemory cells coupled to a word line on which the VWL signal is provided.As explained above, each of the memory cells 162(1-N) stores data, and adata of a corresponding memory cell 162(1-N) is based on whether (and/orto what extent) the corresponding memory cell 162(1-N) is programmed orerased. For example, in the case of charge storage memory cells, such asthose conveniently used in NAND flash memory devices, when the VWLsignal provided to the gate of each of the memory cells 162(1-N) exceedsa corresponding threshold voltage VTH, the respective memory cell162(1-N) conducts, coupling the bitline through the source to thereference node. As a result, the corresponding VSEN(1-N) is low.Alternatively, when the VWL signal does not exceed a correspondingthreshold voltage VTH, the respective memory cell 162(1-N) does notconduct and the corresponding VSEN(1-N) is high.

As explained above, the source has an inherent parasitic resistance RS.Further, some of the memory cells 162(1-N) may have electricalcharacteristics that facilitate higher conductivity, thereby providingan increased current through the corresponding bitline, and,accordingly, increased current through the source. The increasedcurrent, coupled with the inherent parasitic resistance RS of the sourcemay cause a source voltage signal VSRC to be greater than a voltage ofthe reference node. To compensate for the increased voltage, the sensecurrent generator 110 may be coupled to the source, and may provide(e.g., generate) the VBIASPSRC signal with a voltage level that providesthe sense current responsive to the voltage level of the VSRC signalrather than a voltage of the reference node (e.g., ground).

Although FIG. 1 illustrates a string of memory cells as a single memorycell, between the bitline and the source (as may be the case in NORarchitecture) in order to help simplify the discussion of thedisclosure, embodiments of the disclosure also encompass those where thestring of memory cells includes a plurality of memory cells coupled inseries between the bitline and the source, where the single memory cell162 in each string should be viewed as representative of one of aplurality of memory cells in the string. Further, one of ordinary skillin the art would appreciate that the sense current generator 110 may becoupled to the source at any node along the source. In an embodiment,the sense current generator 110 is coupled to the source outside thememory cell array 160 at a node adjacent to the memory cell 162(1). Inanother embodiment, the sense current generator 110 is coupled to thesource outside the memory cell array 160 at a node adjacent to thememory cell 162(N). In yet another embodiment, the sense currentgenerator 110 is coupled to the source inside the memory cell array 160.One of ordinary skill in the art would also appreciate that the VSRC mayvary based on where a node is along the source where the sense currentgenerator 110 is coupled. For example, coupling the sense currentgenerator 110 to the source at a node adjacent to the memory cell 162(1)may result, in a lower VSRC voltage than coupling at a node adjacent tothe memory cell 162(N).

Referring to FIG. 2, an apparatus 200 including a sense currentgenerator according to an embodiment of the invention is disclosed. Theapparatus 200 may include a sense current generator 210 that includes anamplifier 212 coupled to a gate of a feedback transistor 214 and a gateof each of sense current transistors 252(1-N). One sense currenttransistor is shown in FIG. 2, but represents a plurality of sensecurrent transistors 252(1-N). The sense current generator 210 mayinclude the sense current generator 110 of FIG. 1. Each of the sensecurrent transistors 252(1-N) may include one of the sense currenttransistor 152(1-N) of FIG. 1.

The sense current generator 210 receives a bitline reference voltagesignal VBL_REF at a first input and a feedback voltage signal VFB at asecond input. The sense current generator 210 provides a bias voltageVBIASPSRC at an output to a gate of the feedback transistor 214 and agate of each of the sense current transistors 252(1-N). The VBIASPSRCsignal has a voltage that is based on the source voltage.

The feedback transistor 214 may have a source coupled to a voltagesupply node, such as a node coupled to VCC and a drain coupled to asource voltage signal VSRC via a reference resistance RREF 216. Thedrain of the feedback transistor 214 may be coupled to the second inputof the amplifier 212 to provide the VFB signal.

During operation, the amplifier 212 provides the VBIASPSRC signal toprovide a sense current ISENSRC through a sense line of each read-writecircuit such as the read-write circuit 150(1-N) of FIG. 1. The amplifier212 may control a voltage level of the VBIASPSRC signal based on thevoltage of the VFB signal relative to the voltage of the VBL_REF signal.For example, assuming a constant voltage VBL_REF signal, the voltage ofthe VBIASPSRC signal increases as the voltage of the VFB signalincreases and the voltage of the VBIASPRC signal decreases as thevoltage of the VFB signal decreases. A voltage level of the VFB signalis based on current through the feedback transistor 214 as controlled bythe VBIASNSRC and relative to the VSRC signal. As a result, the ISENSRCcurrent is adjusted based on the voltage of the VSRC signal. Asexplained above, the VBIASPSRC signal may be provided to each of thesense current transistors 252(1-N) to provide the sense current ISENSRCthrough each of the sense lines.

Providing the VFB signal having a value that is basal on a voltagedifferential between the VCC and the VSRC signal compensates forinherent parasitic resistance in the source. In contrast to theapparatus 200, a VFB signal based on a voltage differential between theVCC signal and a reference voltage provides the same sense currentthrough the sense lines regardless of a voltage level of the VSRCsignal, for example, when the voltage of the VSRC signal increases to begreater than a voltage level of the reference voltage. An increasedvoltage of the VSRC signal may adjust (e.g., alter) the relative voltageof the VSEN(1-N) voltages, and may lead to erroneous reading of datastored in the corresponding memory cell. Adjusting the ISENSRC currentresponsive to the voltage of the VSRC signal (e.g., reducing ISENSRC forincreasing voltage of the VSRC signal and increasing ISENSRC current fordecreasing voltage of the VSRC signal) may compensate for changes to theVSEN(1-N) voltages caused by the changing voltage of the VSRC signal.

In other embodiments, a development time before read-write detectioncircuits detect stored data, is adjusted to compensate for changingvoltage of the VSRC signal. Referring to FIG. 3, a particular blockdiagram of an apparatus 300 including a sense current generator 310 anda current subtract circuit 320 coupled to a flag signal generator 330.The flag signal generator 330 provides the TDEV_FLAG signal to controllogic 340. The control logic 340, along with a plurality of read-writecircuits (1-N) 350, provide signals to a read-write detection circuit(1-N) 360 to facilitate reading data from a memory array.

The sense current generator 310 may be configured to provide a biasvoltage VBIASP to the plurality of read-write circuits (1-N) 350 basedon a voltage differential between the voltage supply signal VCC and areference voltage signal VREF, rather than a voltage difference betweenthe voltage supply signal VCC and the source voltage signal VSRC. Basedon the VBIASP voltage the plurality of read-write circuits (1-N) 350provide a sense current through a corresponding bitline coupled to theplurality of read-write circuits (1-N) 350.

The current subtract circuit 320 may provide the subtracted bias voltagesignal VBIASNSUB to the flag signal generator 330. The VBIASNSUB signalmay be provided (e.g. generated) by comparing a sense current providedresponsive to the VBIASP signal with a sense current provided responsiveto the VBIASPSRC signal, such as the VBIASPSRC signal provided asdescribed with reference to FIGS. 1 and 2.

During operation, the flag signal generator 330 may receive the VBIASPsignal and the VBIASNSUB signal. The flag signal generator 330 may setthe TDEV_FLAG signal from a logical low value to a logical high valueafter a delay, where a length of the delay is based on the receivedVBIASP and VBIASNSUB signals. The TDEV_FLAG signal may be used b thecontrol logic 340 to provide a read-write control signal R/W CTRL SIG toread-write detection circuits (1-N) 360. For example, the control logic340 may set the R/W CTRL SIG signal to a logical high value uponreceiving the TDEV_FLAG signal having a logical high value. The controllogic 340 may set the R/W CTRL SIG signal to the logical high value fora particular length of time, and may set the R/W CTRL SIG signal to alogical low value once the particular length of time has elapsed. Theflag signal generator 330 may also set the TDEV_FLAG signal to a logicallow value once the particular length of time has elapsed. Responsive tothe R/W CTRL SIG having the logical high value, the read-write detectioncircuits (1-N) 360 may initiate detection of sense voltage signalsVSEN(1-N) received from each one of the respective read-write circuits(1-N) 350. A voltage level of each of the VSEN(1-N) signals may indicatea value of data stored in a corresponding memory cell of a memory array.The read-write circuits (1N) 350 may include the read-write circuits 150of FIG. 1. Each of the read-write circuits (1-N) 350 may provide a sensecurrent signal (not shown) to the read-write detection circuits (1-N)360 rather than or in addition to the VSEN(1-N) signals, and themad-write detection circuits (1-N) 360 may use the sense current signalsto detect a value of data stored in a respective memory cell.

In an embodiment, the length of the delay prior to setting the TDEV_FLAGsignal is set to the logical high value by the flag signal generator 330is inversely related to a voltage level of the VBIASNSUB signal, e.g.,as the voltage level of the VBIASNSUB signal increases, the length ofthe delay before the flag signal generator 330 sets the TDEV_FLAG signalto the logical high value decreases. When a voltage level of theVBIASNSUB signal is approximately equal to zero, the flag signalgenerator 330 sets the TDEV_FLAG signal to the logical high value at afirst time. Further, when the voltage level of the VBIASNSUB is a secondvalue that is greater than zero, the flag signal generator 330 sets theTDEV_FLAG signal to the logical high value at a second time. In anembodiment, the first time is later than the second time.

Configuring the time before initiating detection of data stored in amemory cell based on a voltage of a source compared to a referencevoltage may prevent erroneous reading of data from the memory cell. Ifthe voltage of the source is greater than the reference voltage and thesense current generator 310 provides a sense current based on thereference voltage, it will cause a corresponding sense voltage todevelop more quickly. Having a development time that is too long may,lead to the corresponding sense voltage or current to becomeover-developed and exceed a data threshold voltage or current used forcomparison with the corresponding sense voltage or current,respectively, which may result in erroneous data sensing. By controllingthe read-write detection circuits (1-N) using the TDEV_FLAG signal, theread-write detection circuits (1-N) may detect stored data soonerresponsive to an increasing voltage of the VSRC signal (e.g., asrepresented by the VBIASNSUB signal). As a result, the data detectionmay occur before the sense voltage or current becomes over-developed,which may compensate for increasing voltage of the VSRC signal.

Referring to FIG. 4, an apparatus 400 including a first sense currentgenerator 440 and a second sense current generator 430 that are eachcoupled to a current subtract circuit 450 to provide a subtracted biasvoltage signal VBIASNSUB. The current subtract circuit 450 may includethe current subtract circuit 320 of FIG. 3. The sense current generator430 may include the sense current generator 110 of FIG. 1 and/or thesense current generator 1210 of FIG. 2. The sense current generator 440may include the sense current generator 310 of FIG. 3.

In operation, similar to sense current generator 110 of FIG. 1 and/orthe sense current generator 210 of FIG. 2, the sense current generator430 may provide a bias voltage signal VBIASPSRC to a gate of a sensevoltage bias transistor 462, which provides a sense current ISENSRC.Additionally, the sense current generator 440 may provide a bias voltagesignal VBIASP to a gate of a sense voltage bias transistor 452, whichprovides a sense current based reference voltage ISEN. The VBIASPSRCsignal may have a voltage that is based on a source voltage and theVBIASP signal may have a voltage that is based on a reference voltage.The current subtract circuit 450 subtracts the ISENSRC current from theISEN current via a current mirror transistor 464, a voltage subtractiontransistor 472, and a subtracted voltage bias transistor 454 to providea subtraction current ISUB. The VBIASNSUB signal provided at a nodebetween the sense voltage bias transistor 452 and the subtracted voltagebias transistor 154 is based on the ISUB current. In operation, when theISEN current is approximately equal to the ISENSRC current, the ISUBcurrent is approximately equal to zero, and, accordingly a voltage levelof the VBIASNSUB signal is approximately equal to zero. As the ISENSRCcurrent decreases in magnitude as compared with the ISEN current, thevoltage level of the VBIASNSUB signal increases. As explained withreference to FIG. 3, as the voltage level of the VBIASNSUB signalincreases, a length of time before the TDEV_FLAG is set to the logicalhigh value becomes shorter.

Referring to FIG. 5, an apparatus 500 including a flag signal generator530 according to an embodiment of the invention is disclosed. The flagsignal generator 530 that provides a development flag signal TDEV_FLAGbased on a bias voltage signal VBIASP and a subtracted bias voltagesignal VBIASNSUB. The flag signal generator 530 may be used as the flagsignal generator 330 previously described with reference to FIG. 3.

The flag signal generator 530 may include a first enable transistor 542and a second enable transistor 543, each coupled along a first path. Thefirst enable transistor 542 may include opposite enable polarity ascompared with the second enable transistor 543. For example, the firstenable transistor 542 is enabled when an enable signal EN has a firstlogical value and disabled when the EN signal has a second logicalvalue, and the second enable transistor 543 is disabled when the ENsignal has the first logical value and enabled when the EN signal hasthe second logical value. The EN signal may be set to the second logicalvalue upon commencement of a read operation, e.g. when a bias voltage isapplied to a read-write circuit. The EN signal may be set to the firstlogical value upon completion of a read operation or after a particular(e.g., predetermined) period of time. The first enable transistor 542may be coupled to a voltage supply node, such as VCC and the firstenable transistor 542 may be coupled to a reference node, such as onecoupled to GND.

A development resistance RDEV 544 and a discharge circuit 560 arecoupled between the first enable transistor 542 and the second enabletransistor 543 along the first path. The discharge circuit includesparallel discharge paths. A first discharge path includes a firstdischarge transistor 556 that is controlled by a bias voltage signalVBIASP via a mirror circuit 580. In an embodiment, the VBIASP signal isreceived at a gate of a bias voltage transistor 552, which controls acurrent through a current mirror transistor 554, and a voltage providedto a gate of the first discharge transistor 556. A second discharge pathincludes a second discharge transistor 562 that is controlled by asubtracted bias voltage signal VBIASNSUB.

The flag signal generator 530 also includes a second path coupled to thefirst enable transistor 542 in parallel with the first path. The secondpath includes a development capacitance CDEV 546 coupled to an inverter570. The inverter 570 provides the TDEV_FLAG signal to control logic(not shown), such as the control logic 340 of FIG. 3.

In operation, while the EN signal has the first logical value (e.g.,prior to initiating a read operation), the first enable transistor 542is enabled, thus providing the VCC signal along the first path and alongthe second path. The second enable transistor 543 is disabled, whichrestricts current flow along the first path. Along the second path, thedevelopment capacitance CDEV 546 is charged via the VCC signal toprovide a Vdelay voltage. Additionally, an input to the inverter 570 isa logical high value based on the VCC signal. Accordingly, prior to theread operation, the TDEV_FLAG signal having a logical low value isprovided at an output of the inverter 570.

When the EN signal transitions from the first logical value to thesecond logical value (e.g., indicating a start of a read operation), thefirst enable transistor 542 is disabled, thus restricting the VCC signalfrom the first path and the second path. The development capacitanceCDEV 546 remains charged immediately after the transition of the ENsignal, which maintains the TDEV_FLAG signal at the logical low value.In addition, with the transition of the EN signal to the second logicalvalue, the second enable transistor 543 becomes enabled, whichfacilitates current flow along the first path via the first dischargetransistor 556 and the second discharge transistor 562. The current flowthrough the first discharge transistor 556 and the second dischargetransistor 562 discharges the development capacitance CDEV 546. As thedevelopment capacitance CDEV 546 discharges, the input to the inverter570 transitions from the logical high value to a logical low value,which causes the TDEV_FLAG signal to transition to the logical highvalue. In an embodiment, when a voltage level at the input of theinverter 570 becomes less than a voltage level of the VCC signal dividedby two, the TDEV_FLAG signal transitions to the logical high value. Uponcompletion of the read operation, the EN signal may transition from thesecond logical value to the first logical value. The EN signal havingthe logical high value enables the first enable transistor 542, whichprovides the VCC signal to the input to the inverter 570, causing theinput of the inverter 570 to transition from the logical low value tothe logical high value. Accordingly, the TDEV_FLAG signal transitionsfrom the logical high value to the logical low value at an output of theinverter 570.

As a rate of discharge of the development capacitance CDEV 546increases, a development time period associated with the TDEV_FLAGsignal transitioning to the second logical value decreases. The rate ofdischarge of the development capacitance CDEV 546 is controlled by avoltage level of the VBIASP signal and a voltage level of the VBIASNSUBsignal. The VBIASP voltage may remain fixed based on a voltagedifferential between the VCC signal and the GND signal. The VBIASNSUBsignal may supplement the VBIASP signal in discharging the developmentcapacitance CDEV 546. As explained with reference to FIGS. 3 and 4, theVBIASNSUB signal is based on a voltage differential between a sourcevoltage (e.g., the VSRC signal of FIGS. 1 and 2) and the GND signal.Decreasing the development time should reduce the likelihood ofincorrectly reading data from memory cells of a memory array.

FIG. 6 illustrates a memory 600 according to an embodiment of thepresent invention. The memory 600 includes a memory array 630 with aplurality of memory cells. The memory cells may be non-volatile memorycells, such as NAND flash cells, or may generally be any type of memorycells.

Command signals, address signals and write data signals may be providedto the memory 600 as sets of sequential input/output (“I/O”) signalstransmitted through an I/O bus 628. Similarly, read data signals may beprovided from the memory 600 through the I/O bus 628. The I/O bus 628 isconnected to an I/O control unit 620 that routes the signals between theI/O bus 628 and an internal data bus 622, an internal address bus 624,and an internal command bus 626. The memory 600 also includes a controllogic unit 610 that receives a number of control signals eitherexternally or through the command bus 626 to control the operation ofthe memory 600.

The address bus 624 applies block-row address signals to a row decoder640 and column address signals to a column decoder 650. The row decoder640 and column decoder 650 may be used to select blocks of memory ormemory cells for memory operations, for example, read, program, anderase operations. The column decoder 650 may enable write data signalsto be applied to columns of memory corresponding to the column addresssignals and allow read data signals to be coupled from columnscorresponding to the column address signals.

In response to the memory commands decoded by the control logic unit610, the memory cells in the array 630 are read, programmed, or erased.Read-write circuits 668 coupled to the memory array 630 receive controlsignals from the control logic unit 610 and include voltage generatorsfor generating various pumped voltages for read, program and eraseoperations. The read-write circuits 668 may include the read-writecircuits 150(1-N) of FIG. 1 and/or the read-write circuits 350 of FIG.3. A source voltage compensation circuit 672 is coupled to the read,program, and erase circuits 668. The source voltage compensation circuit672 may include embodiments of the present invention, including thesense current generator 110 of FIG. 1, the sense current generator 210of FIG. 2, the sense current generator 310, the current subtract circuit320, and/or the flag signal generator 330 of FIG. 3, the currentsubtract circuit 420 of FIG. 4, and/or the flag signal generator 530 ofFIG. 5. The source voltage compensation circuit 672 in some embodimentsadjusts a sense current used by the read, program, and erase circuits668 based on a source voltage. In some embodiments, the source voltagecompensation circuit 672 adjusts the detection time of the read,program, and erase circuits 668 based on the source voltage.

After the row address signals have been applied to the address bus 624,the I/O control unit 620 routes write data signals to a cache register670. The write data signals are stored in the cache register 670 insuccessive sets each having a size corresponding to the width of the I/Obus 628. The cache register 670 sequentially stores the sets of writedata signals for an entire row or page of memory cells in the array 630.All of the stored write data signals are then used to program a row orpage of memory cells in the array 630 selected by the block-row addresscoupled through the address bus 624. In a similar manner, during a readoperation, data signals from a row or block of memory cells selected bythe block-row address coupled through the address bus 624 are stored ina data register 680. Sets of data signals corresponding in size to thewidth of the I/O bus 628 are then sequentially transferred through theI/O control unit 620 from the data register 680 to the I/O bus 628.

From the foregoing it will be appreciated that, although specificembodiments of the invention have been described herein for purposes ofillustration, various modifications may be made without deviating fromthe spirit and scope of the invention. Accordingly, the invention is notlimited except as by the appended claims.

What is claimed is:
 1. An apparatus, comprising: a sense currentgenerator coupled to a node of a source line coupled to a memory cell,the sense current generator configured to control a sense current usedto access the memory cell by sensing a current through a feedbacktransistor coupled to the source line via a reference resistance.
 2. Theapparatus of claim 1, wherein the sense current generator furthercomprises an amplifier coupled to the feedback transistor and the sourceline, the amplifier configured to provide a bias voltage to a read/writecircuit based on a feedback voltage received at the input of theamplifier.
 3. The apparatus of claim 1, further comprising a read/writecircuit coupled to the memory cell.
 4. The apparatus of claim 3, whereinthe sense current generator configured to control the sense current usedto access the memory cell comprises the sense current generator coupledto a sense current transistor of the read write circuit and the sensecurrent generator configured to provide a bias voltage to a gate of thesense current transistor based on the voltage of the node of the sourceline.
 5. The apparatus of claim 4, wherein the sense current generatoris configured to provide the bias voltage to the read-write circuitresponsive a memory access command.
 6. The apparatus of claim 1, furthercomprising a string of memory cells that includes the memory cell.
 7. Amethod, comprising: providing a bias voltage to a read-write circuit andto a gate of a feedback transistor having a voltage based on a feedbackvoltage, wherein the feedback voltage is sensed from a node between thefeedback transistor and a resistance coupled to a source line; andproviding a sense current at the read-write circuit having a value basedon the voltage of the bias voltage.
 8. The method of claim 7, furthercomprising detecting that the voltage of the source line is greater thana reference voltage.
 9. The method of claim 7, wherein providing thebias voltage to the read-write circuit comprises providing the biasvoltage to a gate of a sense current transistor.
 10. The method of claim7, further comprising activating a source line transistor to couple thesource line to a reference node.
 11. The method of claim 7, furthercomprising detecting a value stored in a memory cell based on the sensecurrent.
 12. The method of claim 7, further comprising receiving thefeedback voltage from the feedback node.